Job overview:

This is a senior engineering role for a hands-on engineer with >5 years experience in optical design, thermal design, photonic integrated circuit (PIC) packaging, telecom/datacom photonic component testing.

Responsibilities:

• Lead:
• optical design of coupling systems for PIC’s for datacom applications
• thermal design of PIC packaging for datacom applications
• the specification of optical and thermal interface requirements of PIC’s

• Contribute to:
  • PIC packaging technology development
  • DC and high speed characterisation of packaged photonic components
  • the design of custom photonic component measurement equipment

Skills & Experience:

• Required:
  • BSc in Physics/Photonics or related subject
  • >5 years industry experience
  • Proficiency with optical design packages (e.g. Zemax)
• Desirable:
  • MSc or PhD preferred
  • Proficiency with multiphysics simulation packages (e.g. Ansys, COMSOL)
  • Optical alignment process development for volume manufacturing
• Able to:
  • work with Supply Chain Management to identify optical component vendors
  • specify optical component measurement equipment
  • work with PIC designers, mechanical designers and test engineers to optimise PIC and packaging design for performance, manufacturing and test